Oplink’s polarization maintaining beam combiner is based on athermal platform. The technology is a lead-free packaging platform and has an epoxy-free optical path. These devices feature super high extinction ratio, very high power handling and low insertion loss. They are designed to work as pump combiners for EDFA, Raman amplifier systems and 40-Gbps, 100-Gbps transmission system. Oplink’s patented packaging technology ensures the highest quality and reliability.
Oplink can provide customized designs to meet specialized feature applications. Also, Oplink offers modular assemblies that integrate other components to form a full function module subsystem.